By putting optics in silicon, CPO promises dramatic boosts in speed while lowering power requirements, if it can meet ...

HUID utilizes onion waste to create paper-based packaging such as moulded fibre and board products. The company was a ...

DIGITIMES Asia forecasts that the global market size for advanced packaging of data center AI chips will grow from US$5.6 billion in 2024 to US$53.1 billion in 2030, representing a CAGR of over 40%.

Aduro Clean Technologies Inc., London, Ontario, has entered a multiyear framework collaboration with ECOCE, a Mexican ...

Nelipak Corp buys Merrill's Packaging to expand custom thermoformed solutions for medical device and pharmaceutical ...

Engineering and Artificial Intelligence researchers from the University of Maryland teamed up to accelerate the search for ...

As detailed in the latest report by Towards Packaging, the global Europe glass prefilled syringes and glass vials packaging ...

Ethylene Vinyl Alcohol Market to reach US$ 2.7 Bn by 2035 at 5.5% CAGR, driven by demand for high-barrier and sustainable ...

USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high-aspect ratio copper pillar mass-transfer technology, the company said. After three years ...

CRANSTON, R.I., Dec. 08, 2025 (GLOBE NEWSWIRE) -- Nelipak® Corporation ("Nelipak”), a leading global provider of healthcare ...

BW Packaging has announced the launch of its Hayssen X850 multi-jaw flow wrapper, designed for cheese and other products that ...