DIGITIMES Asia forecasts that the global market size for advanced packaging of data center AI chips will grow from US$5.6 billion in 2024 to US$53.1 billion in 2030, representing a CAGR of over 40%.
Nelipak Corp buys Merrill's Packaging to expand custom thermoformed solutions for medical device and pharmaceutical ...
Packaging Gateway on MSN
Veritiv unveils fibre-based pallet shipper for biopharma cold chain
Veritiv has expanded its TempSafe cold chain packaging line in the US with the launch of TempSafe PalletShield.
Engineering and Artificial Intelligence researchers from the University of Maryland teamed up to accelerate the search for ...
Borealis and Borouge have revealed a global portfolio of mechanically recycled, post-industrial and consumer recyclates and ...
Amcor upfronts its range of rigid and flexible packaging solutions for de-icing salt, designed for easy pouring and storage, ...
USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high-aspect ratio copper pillar mass-transfer technology, the company said. After three years ...
CRANSTON, R.I., Dec. 08, 2025 (GLOBE NEWSWIRE) -- Nelipak® Corporation ("Nelipak”), a leading global provider of healthcare ...
According to the latest report published by , global data center AI chip shipments are projected to grow from in 2024 to in 2030. This data center AI chip category includes high-end and mid-range GPUs ...
Packaging Gateway on MSN
Borouge and Borealis unveil Recleo recycled polyolefin product line
Material firms Borouge and Borealis have introduced Recleo, a global brand for mechanically recycled polyolefins.
Federal government says it’s working to phase out single-use plastics and transform Australia’s packaging rules.
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