Balancing yield and test is essential to semiconductor manufacturing, but it’s becoming harder to determine how much weight to give one versus the other as chips become more specialized for different ...
The entire stress-strain curve can now be determined using nanoindentation with a flat-ended cylindrical punch and novel analysis of the resulting force-displacement data 1. Unlike pyramidal indenters ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback