With almost 10 million SiP shipment, GUC SiP service leads to a fast, low cost, and low risk way to realize products with high embedded memory requirements Hsinchu, Taiwan -- April 14, 2008 –Global ...
The SiP Flow help designers ensure component design success with accurate and systematic analysis of inter-die and package effects Hsinchu, Taiwan -- July. 27, 2009 --Global Unichip Corp. (GUC; TW: ...
Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...
San Jose, Calif. — Systems-in-package may have a time-to-market advantage over systems-on-chip, but the lack of SiP design tool support could chip away at that edge, say both users and EDA tool ...
Being able to integrate voice and data is a strong desire of business as well as of residential users. This type of integration is inefficient, however, on the telephone legacy of channelled voice ...
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